On December 26, #semiconductor packaging and testing giant #ASE Technology announced that its subsidiary ASE Semiconductor has leased the Kaohsiung Nanzi plant of Taiwan's Foley Electronics to expand its packaging capacity. Industry analysts analyzed that the main purpose of the moonlight for the expansion of #AI chip advanced packaging capacity, but not related to CoWoS packaging. ASE Technology announcement shows that Kaohsiung Nanzi District plant buildings total area of about 15,600 square meters (about 4,735 square feet), the total amount of the right to use the assets is expected to be NT $ 742 million. In October this year, the results of the briefing, ASE estimated advanced packaging next year's performance can be doubled compared to this year. The industry assesses the size of the capital expenditure of ASE Technology this year, about 1 billion U.S. dollars, 80% in packaging and testing, 2% in electronic foundry services, which in the packaging and testing, about 6% more than the proportion of the encapsulation project, including advanced packaging, more than 3% more than the proportion of the test project. ASE's website shows that it has integrated six core packaging technologies and launched the VIPack advanced packaging platform. Including ASE based on high-density RDL Fan Out Package-on-Package (#FOPoP), Fan Out Chip-on-Substrate (#FOCoS), Fan Out Chip-on-Substrate-Bridge (#FOCoS-Bridge), Fan Out System-in-Package (#FOPoP), System-in-Package (#FOSiP) as well as 2.5D/3D ICs and Co-Packaged Optics based on through-silicon vias (#TSVs). #chip #ElectronicComponents #perceptive-ic.com