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  • According to #AdroitMarketResearch, the #wirelessbridgemarket size is expected to reach USD 4,450.9 million by 2028, growing at a CAGR of 12.7% from 2022 to 2028. The #wireless bridges market plays a vital role in the wider wireless communication sector by facilitating seamless and secure connectivity between different networks. This innovative technology allows connecting multiple wireless networks, thereby improving communication and data transfer capabilities. The growing demand for reliable and high-performance network connectivity across various industries such as #IT, #telecom, #industrial, #residential, and #commercial sectors underscores its importance. The expansion of this market is primarily driven by the increasing use of Internet-connected devices and growing demand for effective network infrastructure solutions. #electronicsIndustry #semiconductor #electroniccomponents #perceptive #electronics #technologyelectronics #chipmarket
    According to #AdroitMarketResearch, the #wirelessbridgemarket size is expected to reach USD 4,450.9 million by 2028, growing at a CAGR of 12.7% from 2022 to 2028. The #wireless bridges market plays a vital role in the wider wireless communication sector by facilitating seamless and secure connectivity between different networks. This innovative technology allows connecting multiple wireless networks, thereby improving communication and data transfer capabilities. The growing demand for reliable and high-performance network connectivity across various industries such as #IT, #telecom, #industrial, #residential, and #commercial sectors underscores its importance. The expansion of this market is primarily driven by the increasing use of Internet-connected devices and growing demand for effective network infrastructure solutions. #electronicsIndustry #semiconductor #electroniccomponents #perceptive #electronics #technologyelectronics #chipmarket
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  • The market for mobile PCs with organic light-emitting diode (OLED) displays is expected to more than double by 2024 and continue to climb through 2028, Omdia said. The market researcher expects to ship 3.7 million tablets and 3.4 million laptops with OLED displays in 2023; a total of 7.1 million. Omdia expects the number of tablets with OLED displays to increase to 12.1 million by 2024, and the number of laptops to reach 5.1 million, for a total of 17.2 million units. This growth will continue through 2028, when 72.3 million tablets and laptops will be shipped, but penetration in the overall mobile PC display market will still be only 14 percent. Still, Omdia is looking at 2024 as a transition year as Apple adopts OLED displays on mobile PCs. The iPadPro with OLED display will launch in 2024. Samsung's hybrid OLED displays will be produced at its Gen 6 plants, with LG Display's E6 Gen 6 flexible OLED plant and Samsung Display's A3 Gen 6 flexible OLED plant being used for mass production. Both plants were originally designed for smartphone display applications, but were modified to facilitate larger panel production. Omdia believes that Apple now plans to expand OLED displays to the iPadAir and MacBookPro in 2026 and to the iPadMini and MacBookAir in 2027. The high price of high-performance displays is why Apple first introduced OLEDs in its high-end products, but prices are expected to come down as sales increase, allowing the improved displays to be used in a wider range of products. If you are interested in electronic components, you can visit: https://www.perceptive-ic.com/.
    The market for mobile PCs with organic light-emitting diode (OLED) displays is expected to more than double by 2024 and continue to climb through 2028, Omdia said. The market researcher expects to ship 3.7 million tablets and 3.4 million laptops with OLED displays in 2023; a total of 7.1 million. Omdia expects the number of tablets with OLED displays to increase to 12.1 million by 2024, and the number of laptops to reach 5.1 million, for a total of 17.2 million units. This growth will continue through 2028, when 72.3 million tablets and laptops will be shipped, but penetration in the overall mobile PC display market will still be only 14 percent. Still, Omdia is looking at 2024 as a transition year as Apple adopts OLED displays on mobile PCs. The iPadPro with OLED display will launch in 2024. Samsung's hybrid OLED displays will be produced at its Gen 6 plants, with LG Display's E6 Gen 6 flexible OLED plant and Samsung Display's A3 Gen 6 flexible OLED plant being used for mass production. Both plants were originally designed for smartphone display applications, but were modified to facilitate larger panel production. Omdia believes that Apple now plans to expand OLED displays to the iPadAir and MacBookPro in 2026 and to the iPadMini and MacBookAir in 2027. The high price of high-performance displays is why Apple first introduced OLEDs in its high-end products, but prices are expected to come down as sales increase, allowing the improved displays to be used in a wider range of products. If you are interested in electronic components, you can visit: https://www.perceptive-ic.com/.
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  • The microprocessor market size is expected to exceed USD 72 billion by 2022 and is projected to grow at a CAGR of 7.6% from 2023 to 2032, reaching an estimated value of USD 142 billion. The rapid growth in the usage of portable medical devices across the globe is driving the market. According to a recent market study, Asia Pacific is expected to have a significant impact on the global microprocessor industry. This is mainly attributed to the growing demand for consumer electronics, rapid industrial development, and large presence of leading semiconductor manufacturers in countries/regions such as China, South Korea, and Taiwan. Together, these factors have consolidated the region’s strong position in the microprocessor sector. The leading player in the global microprocessor market is the Complex Instruction Set Computer (CISC) technology, which is widely recognized for its ability to handle complex instructions efficiently. The technology is popular across industries for its versatility in performing multiple functions and is well suited for multifunctional applications. The major advantage of CISC technology is its wide instruction range and efficient utilization of memory, making it a preferred choice for general-purpose computing needs. Hence, CISC technology is expected to hold the largest market share in the global microprocessor industry. For more exciting articles, please click perceptive-ic.com.
    The microprocessor market size is expected to exceed USD 72 billion by 2022 and is projected to grow at a CAGR of 7.6% from 2023 to 2032, reaching an estimated value of USD 142 billion. The rapid growth in the usage of portable medical devices across the globe is driving the market. According to a recent market study, Asia Pacific is expected to have a significant impact on the global microprocessor industry. This is mainly attributed to the growing demand for consumer electronics, rapid industrial development, and large presence of leading semiconductor manufacturers in countries/regions such as China, South Korea, and Taiwan. Together, these factors have consolidated the region’s strong position in the microprocessor sector. The leading player in the global microprocessor market is the Complex Instruction Set Computer (CISC) technology, which is widely recognized for its ability to handle complex instructions efficiently. The technology is popular across industries for its versatility in performing multiple functions and is well suited for multifunctional applications. The major advantage of CISC technology is its wide instruction range and efficient utilization of memory, making it a preferred choice for general-purpose computing needs. Hence, CISC technology is expected to hold the largest market share in the global microprocessor industry. For more exciting articles, please click perceptive-ic.com.
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  • In 2024, the market will continue to focus on AI issues, and suppliers will launch AI high-end #chips one after another. With the increase in computing speed, #TrendForce said that in 2024, the average capacity of #DRAM and #NAND Flash in various #AI extension applications, such as #smartphones, #servers, and #notebooks, will grow. The server sector will see the highest growth, with Server DRAM's average standalone capacity estimated to increase by 17.3% annually, while Enterprise SSDs are estimated to increase by 13.2% annually. #perceptive-ic.com #ElectronicComponents
    In 2024, the market will continue to focus on AI issues, and suppliers will launch AI high-end #chips one after another. With the increase in computing speed, #TrendForce said that in 2024, the average capacity of #DRAM and #NAND Flash in various #AI extension applications, such as #smartphones, #servers, and #notebooks, will grow. The server sector will see the highest growth, with Server DRAM's average standalone capacity estimated to increase by 17.3% annually, while Enterprise SSDs are estimated to increase by 13.2% annually. #perceptive-ic.com #ElectronicComponents
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  • Infineon Introduces Hybrid Time-of-Flight (hToF) Infineon, in collaboration with OMS and pmdtechnologies, has developed a new hybrid time-of-flight (hToF) solution that provides enhanced depth sensing and 3D scene understanding for next-generation intelligent consumer robots. The new hToF solution combines two depth sensing concepts and helps to significantly reduce the maintenance effort and costs of intelligent robots. Infineon’s REAL3 flexible ToF imager technology combines existing high-resolution iToF flood and dToF long-range point illumination in a single hybrid time-of-flight camera. This high-resolution technology has been used for years to see and navigate around the smallest objects in a robot’s path. Now, the addition of precise remote point data also creates an accurate 3D map of the surrounding area, enabling an intelligent path-planning experience even in bright sunlight or dark, challenging lighting conditions, to power the next generation of robotic vacuum cleaners. The new solution reduces the height of the robotic vacuum cleaner by 20–30% and completely replaces the top-mounted LDS (Laser Distance Scanner), enabling cleaning even under furniture with small gaps. For more exciting articles, please click: https://www.perceptive-ic.com/news/
    Infineon Introduces Hybrid Time-of-Flight (hToF) Infineon, in collaboration with OMS and pmdtechnologies, has developed a new hybrid time-of-flight (hToF) solution that provides enhanced depth sensing and 3D scene understanding for next-generation intelligent consumer robots. The new hToF solution combines two depth sensing concepts and helps to significantly reduce the maintenance effort and costs of intelligent robots. Infineon’s REAL3 flexible ToF imager technology combines existing high-resolution iToF flood and dToF long-range point illumination in a single hybrid time-of-flight camera. This high-resolution technology has been used for years to see and navigate around the smallest objects in a robot’s path. Now, the addition of precise remote point data also creates an accurate 3D map of the surrounding area, enabling an intelligent path-planning experience even in bright sunlight or dark, challenging lighting conditions, to power the next generation of robotic vacuum cleaners. The new solution reduces the height of the robotic vacuum cleaner by 20–30% and completely replaces the top-mounted LDS (Laser Distance Scanner), enabling cleaning even under furniture with small gaps. For more exciting articles, please click: https://www.perceptive-ic.com/news/
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  • Hall effect switches and latches, what are the automotive applications? utomotive applications such as advanced driver assistance systems (ADAS), window lift encoders, seat motors, seat belt tensioners and locking systems are largely driving their demand. Hall-effect sensor ICs are also widely used in driver controllers for off-road vehicles, heavy equipment, human-machine interface (HMI) and rollover (bank angle) sensors, mounts, and two-wheeled vehicles. They facilitate the fastest diagnostics on magnetic switches and latches and provide logic-compatible outputs that can communicate sensor status and support open/short circuit detection on lines.Examples of Hall-effect sensor ICs from Allegro MicroSystems are the APS11450 unipolar switch IC and the APS12450 bipolar latch. Diodes' AH371xQ family of high-voltage Hall-effect latches is also aimed at a variety of automotive applications. It is the original article and can be viewed by clicking on it. https://www.perceptive-ic.com/news-detailed/Hall-Effect-Switches-and-Latches-What-are-the-Automotive-Applications
    Hall effect switches and latches, what are the automotive applications? utomotive applications such as advanced driver assistance systems (ADAS), window lift encoders, seat motors, seat belt tensioners and locking systems are largely driving their demand. Hall-effect sensor ICs are also widely used in driver controllers for off-road vehicles, heavy equipment, human-machine interface (HMI) and rollover (bank angle) sensors, mounts, and two-wheeled vehicles. They facilitate the fastest diagnostics on magnetic switches and latches and provide logic-compatible outputs that can communicate sensor status and support open/short circuit detection on lines.Examples of Hall-effect sensor ICs from Allegro MicroSystems are the APS11450 unipolar switch IC and the APS12450 bipolar latch. Diodes' AH371xQ family of high-voltage Hall-effect latches is also aimed at a variety of automotive applications. It is the original article and can be viewed by clicking on it. https://www.perceptive-ic.com/news-detailed/Hall-Effect-Switches-and-Latches-What-are-the-Automotive-Applications
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    Hall Effect Switches and Latches What are the Automotive Applications
    With an installed base of billions of devices, Hall-effect sensor ICs are steadily growing while serving a wide range of motor control and automation applications.
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  • #AMD has announced the launch of the first #AI central processing unit (#CPU) for desktops. AMD stated that the #Ryzen 8000G family of #chips is expected to be available to DIY customers and system integrator partners starting January 31, 2024, with systems from various #OEMs expected to be available in the second quarter of 2024. AMD said it will also bring dedicated AI neural network processors (#NPUs) to desktop #processors for the first time with the introduction of #Ryzen AI. #ElectronicComponents #perceptive-ic.com#Semiconductor
    #AMD has announced the launch of the first #AI central processing unit (#CPU) for desktops. AMD stated that the #Ryzen 8000G family of #chips is expected to be available to DIY customers and system integrator partners starting January 31, 2024, with systems from various #OEMs expected to be available in the second quarter of 2024. AMD said it will also bring dedicated AI neural network processors (#NPUs) to desktop #processors for the first time with the introduction of #Ryzen AI. #ElectronicComponents #perceptive-ic.com#Semiconductor
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  • Global #semiconductor capacity is expected to grow by 6.4% in 2024, surpassing the 30 million wafers per month (#wpm) mark for the first time, after growing 5.5% to 29.6 wpm in 2023, #SEMI announced yesterday in its latest quarterly World Fab Forecast. Growth in 2024 will be driven by increases in leading-edge logic and foundry capacity, applications such as generative #AI and high-performance computing (#HPC), and a recovery in end-use demand for chips. Capacity expansion slows in 2023 due to weak demand in the #semiconductormarket and resulting inventory adjustments. "Recovering global market demand and strengthening government incentives are driving a surge in fab investment in major #chip manufacturing regions, with global capacity expected to grow by 6.4 percent in 2024," said Ajit Manocha, SEMI's president and chief executive officer. "The elevated worldwide spotlight on the strategic significance of semiconductor manufacturing for #national and #economic security is a key catalyst for these trends." The World Fab Forecast report covers the period from 2022 to 2024, when the global semiconductor industry plans to bring 82 new fabs into production, including 11 projects in 2023 and 42 projects in 2024, with wafer sizes ranging from 300mm to 100mm. #ElectronicComponents #perceptive-ic.com
    Global #semiconductor capacity is expected to grow by 6.4% in 2024, surpassing the 30 million wafers per month (#wpm) mark for the first time, after growing 5.5% to 29.6 wpm in 2023, #SEMI announced yesterday in its latest quarterly World Fab Forecast. Growth in 2024 will be driven by increases in leading-edge logic and foundry capacity, applications such as generative #AI and high-performance computing (#HPC), and a recovery in end-use demand for chips. Capacity expansion slows in 2023 due to weak demand in the #semiconductormarket and resulting inventory adjustments. "Recovering global market demand and strengthening government incentives are driving a surge in fab investment in major #chip manufacturing regions, with global capacity expected to grow by 6.4 percent in 2024," said Ajit Manocha, SEMI's president and chief executive officer. "The elevated worldwide spotlight on the strategic significance of semiconductor manufacturing for #national and #economic security is a key catalyst for these trends." The World Fab Forecast report covers the period from 2022 to 2024, when the global semiconductor industry plans to bring 82 new fabs into production, including 11 projects in 2023 and 42 projects in 2024, with wafer sizes ranging from 300mm to 100mm. #ElectronicComponents #perceptive-ic.com
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  • On December 26, #semiconductor packaging and testing giant #ASE Technology announced that its subsidiary ASE Semiconductor has leased the Kaohsiung Nanzi plant of Taiwan's Foley Electronics to expand its packaging capacity. Industry analysts analyzed that the main purpose of the moonlight for the expansion of #AI chip advanced packaging capacity, but not related to CoWoS packaging. ASE Technology announcement shows that Kaohsiung Nanzi District plant buildings total area of about 15,600 square meters (about 4,735 square feet), the total amount of the right to use the assets is expected to be NT $ 742 million. In October this year, the results of the briefing, ASE estimated advanced packaging next year's performance can be doubled compared to this year. The industry assesses the size of the capital expenditure of ASE Technology this year, about 1 billion U.S. dollars, 80% in packaging and testing, 2% in electronic foundry services, which in the packaging and testing, about 6% more than the proportion of the encapsulation project, including advanced packaging, more than 3% more than the proportion of the test project. ASE's website shows that it has integrated six core packaging technologies and launched the VIPack advanced packaging platform. Including ASE based on high-density RDL Fan Out Package-on-Package (#FOPoP), Fan Out Chip-on-Substrate (#FOCoS), Fan Out Chip-on-Substrate-Bridge (#FOCoS-Bridge), Fan Out System-in-Package (#FOPoP), System-in-Package (#FOSiP) as well as 2.5D/3D ICs and Co-Packaged Optics based on through-silicon vias (#TSVs). #chip #ElectronicComponents #perceptive-ic.com
    On December 26, #semiconductor packaging and testing giant #ASE Technology announced that its subsidiary ASE Semiconductor has leased the Kaohsiung Nanzi plant of Taiwan's Foley Electronics to expand its packaging capacity. Industry analysts analyzed that the main purpose of the moonlight for the expansion of #AI chip advanced packaging capacity, but not related to CoWoS packaging. ASE Technology announcement shows that Kaohsiung Nanzi District plant buildings total area of about 15,600 square meters (about 4,735 square feet), the total amount of the right to use the assets is expected to be NT $ 742 million. In October this year, the results of the briefing, ASE estimated advanced packaging next year's performance can be doubled compared to this year. The industry assesses the size of the capital expenditure of ASE Technology this year, about 1 billion U.S. dollars, 80% in packaging and testing, 2% in electronic foundry services, which in the packaging and testing, about 6% more than the proportion of the encapsulation project, including advanced packaging, more than 3% more than the proportion of the test project. ASE's website shows that it has integrated six core packaging technologies and launched the VIPack advanced packaging platform. Including ASE based on high-density RDL Fan Out Package-on-Package (#FOPoP), Fan Out Chip-on-Substrate (#FOCoS), Fan Out Chip-on-Substrate-Bridge (#FOCoS-Bridge), Fan Out System-in-Package (#FOPoP), System-in-Package (#FOSiP) as well as 2.5D/3D ICs and Co-Packaged Optics based on through-silicon vias (#TSVs). #chip #ElectronicComponents #perceptive-ic.com
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  • Qualcomm announced its Snapdragon X Elite processor in late October, shortly after Apple launched its first 3nm chipsets for the Mac lineup: the M3, M3 Pro and M3 Max. Qualcomm claims that while the thermal profile of its new Snapdragon X Elite PC processors remains questionable, multi-core performance is still 21 percent faster than Apple’s latest M3 chips. When demonstrating a PC with the new chipset, the Qualcomm Snapdragon X Elite reportedly scored 15,300 multi-core points, while the M3 lagged behind the Qualcomm chip with a score of 12,154. The test conducted was Geekbench 6, but Qualcomm cleverly omitted one important detail from these results: the Snapdragon X Elite’s power limit which is an important indicator of the processor’s efficiency performance. It is understood that Qualcomm’s upcoming 2024 Windows PC lineup is expected to feature a different thermal design configuration. The performance-focused 80W profile runs faster but generates more heat and requires active cooling (fans), while the efficiency-focused 23W profile is for thinner laptops with passive cooling systems. If you like this article, click into perceptive-ic.com to see more.
    Qualcomm announced its Snapdragon X Elite processor in late October, shortly after Apple launched its first 3nm chipsets for the Mac lineup: the M3, M3 Pro and M3 Max. Qualcomm claims that while the thermal profile of its new Snapdragon X Elite PC processors remains questionable, multi-core performance is still 21 percent faster than Apple’s latest M3 chips. When demonstrating a PC with the new chipset, the Qualcomm Snapdragon X Elite reportedly scored 15,300 multi-core points, while the M3 lagged behind the Qualcomm chip with a score of 12,154. The test conducted was Geekbench 6, but Qualcomm cleverly omitted one important detail from these results: the Snapdragon X Elite’s power limit which is an important indicator of the processor’s efficiency performance. It is understood that Qualcomm’s upcoming 2024 Windows PC lineup is expected to feature a different thermal design configuration. The performance-focused 80W profile runs faster but generates more heat and requires active cooling (fans), while the efficiency-focused 23W profile is for thinner laptops with passive cooling systems. If you like this article, click into perceptive-ic.com to see more.
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